Asian Paints

2285.2 -21.90

Cipla

1313.2 -38.40

Eicher Motors

7626.5 -199.50

Nestle India

1245.3 -34.40

Grasim Inds

2683.2 -94.10

Hindalco Inds.

921.8 -18.20

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2261.3 -59.30

ITC

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M & M

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1345 -13.00

Tata Consumer

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Tata Motors PVeh

351.2 -19.40

Tata Steel

196.73 -14.28

Wipro

195.55 -3.02

Apollo Hospitals

7666 -125.50

Dr Reddy's Labs

1291.2 -3.20

Titan Company

4204.4 -65.90

SBI

1174.5 -15.40

Shriram Finance

1010 -42.50

Bharat Electron

446.85 -7.10

Kotak Mah. Bank

403.35 -9.75

Infosys

1307.4 18.50

Bajaj Finance

945.1 -33.15

Adani Enterp.

2076.5 -48.10

Sun Pharma.Inds.

1750.5 -2.00

JSW Steel

1213 -54.30

HDFC Bank

868.65 -10.75

TCS

2587.8 -25.70

ICICI Bank

1365.4 -8.60

Power Grid Corpn

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Maruti Suzuki

14158 -230.00

Axis Bank

1351.3 -21.00

HCL Technologies

1364 -7.00

O N G C

276.95 -5.25

NTPC

365.8 -11.75

Coal India

435.15 8.90

Bharti Airtel

1905.9 32.70

Tech Mahindra

1351.2 5.80

Jio Financial

241.3 -7.70

Adani Ports

1434.4 -35.90

HDFC Life Insur.

684.6 -22.70

SBI Life Insuran

1930.6 -101.60

Max Healthcare

1053.7 -29.90

UltraTech Cem.

12107 -414.00

Bajaj Auto

9652.5 -123.50

Bajaj Finserv

1889.3 -52.60

Interglobe Aviat

4392.9 -127.50

Eternal

240.73 -2.14

Corporate News - Detailed News Back
DCX Systems enhances its manufacturing capabilities to oversized PCB assembly
04-Mar-26   13:57 Hrs IST

DCX Systems (DCX) announced the expansion of the manufacturing capabilities with the addition of oversized PCB assembly capacity at its wholly owned subsidiary, Raneal Advanced Systems (Raneal). This strategic enhancement strengthens DCX/Raneal's ability to support complex, large-format Printed Circuit Board (PCB) requirements across high-reliability industries.

The newly enhanced capability enables the company to assemble and test large dimension PCBs, catering to applications mainly in defense & aerospace and industrial electronics and advanced power systems. With this expansion, the company can now accommodate boards exceeding conventional size limitations, meeting growing customer demand for integrated and high-density electronic assemblies.

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